HP RX2660 Integrity Server

Features Description Processor Board Processor cores: 1-4 Module type Dual core and Single core Front-side bus: 533 MHz Chipset: HP zx2 Dual-core Processor Modules Type: Intel Itanium 2 processor Speed: 1.6 GHz /18 MB Intel Itanium 2 Speed: 1.4 GHz/12 MB Intel Itanium 2 Level 1 cache: 32 KB Level cache 2: 1 MB instruction/256 KB data per core Level 3 cache: 18 MB (9 MB per core) Single core Processor Modules Type: Intel Itanium 2 processor Speed: 1.6 GHz/6 MB Intel Itanium 2 Level 1 cache: 32 KB Level cache 2: 1 MB instruction/256 KB data per core Level 3 cache: 6 MB Main memory RAM type: Chip spare ECC x4 single rank Registered DDR2 SDRAM RAM minimum/maximum: 1 GB/32 GB Memory protection: Error checking and correcting (ECC) on memory and caches; double chip spare Internal storage devices Internal hard drive bays: 8 hot-plug Small Form Factor Serial Attached SCSI (SAS) Hard drive capacity: 36 GB, 73 GB, 146 GB and 300 GB Small Form Factor Serial Attached SCSI (SAS) drives available Removable media: 1 open bay for DVD-ROM or DVD+RW Drive Storage controller: 8-port Serial Attached SCSI (SAS) controller supports internal devices only. I/O slots Choice of one of two options: All PCI-X Card Cage: 3 full-length PCI-X slots (2 - 266 MHz/64-bit, 1 - 133 MHz/64-bit) for 5.3 GB/s of I/O bandwidth (total bandwidth with core I/O is 7.0 GB/s) Combination Card Cage: 3 full-length slots (2 PCI Express slots - 2.6 GB/s of bandwidth each, and 1 PCI-X slot - 133 MHz/64-bit) for a total of 6.3 GB/s of I/O bandwidth (total bandwidth with core I/O is 8.0 GB/s) Interfaces VGA and 3 USB ports for local human interface 1 RS-232 serial port for general use 1 RS-232 serial port and 10/100Base-T LAN for Integrated Lights Out (iLO 2) management Form factor Rack-optimized with 2U height; standalone (rack-less) form factor kit Specifications Environmental Temperature Operating: +5o to +35o C (+41o to +95o F) Non-operating: -40o to +70o C (-40o to +158o F) Maximum rate of temperature change: 36